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2017. október 25. - hecomnaza

Silicon Wafer Bonding Technology for VLSI and MEMS Applications (Emis Processing Series, 1)

by Subramanian S. Iyer

->->->->DOWNLOAD BOOK Silicon Wafer Bonding Technology for VLSI and MEMS Applications (Emis Processing Series, 1)


The use of silicon-on-insulator (SOI) technology in microelectronics is proliferating and is ready to be applied in a growing number of IC fabrication situations. Bonding of single crystal Si to diel



























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Silicon Wafer Bonding Technology For VLSI And MEMS Applications (Emis Processing Series, 1) Subramanian S. Iyer

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